The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Apr. 30, 2024
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
An electronic package and a manufacturing method thereof are provided, in which at least one groove and a plurality of openings are formed on a first side of a carrier member, a plurality of conductive pillars are formed in the plurality of openings, a first electronic element is accommodated in the groove, a plurality of conductive elements are formed on a second side of the carrier member and electrically connected to the plurality of conductive pillars and the first electronic element, and a circuit structure is formed on the first side of the carrier member and electrically connected to the plurality of conductive pillars and the first electronic element. Therefore, a board body made of semiconductor material serves as the carrier member, so that the coefficient of thermal expansion (CTE) of the carrier member matches the CTE of the first electronic element, which is beneficial to dispersing thermal stress.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile