This inventor holds 2 USPTO granted patents and 7 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun-Chu Lai: Inventor of a Miniaturized Electronic Package
Introduction
Chun-Chu Lai is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. His patent work addresses electronic packaging and the demand for smaller, thinner devices. The available information credits him with 1 patent.
Latest Patents
Lai’s listed patent is “Electronic Package and Manufacturing Method Thereof.” It describes forming a groove in a wiring structure to accommodate an electronic element, then covering the element with an encapsulation layer. The groove-based design can reduce the package’s overall thickness and support device miniaturization.
Career Highlights
Lai’s documented invention focuses on a practical challenge in electronic packaging: reducing thickness while housing and protecting an electronic component. The patent presents both the package structure and a method for manufacturing it.
Collaborations
The provided information identifies Chung-Chih Yen and Kuo-Hui Wan as Lai’s coworkers. It does not specify whether they collaborated with him on the patent.
Conclusion
Chun-Chu Lai’s listed patent contributes a groove-based approach to thinner electronic packaging, reflecting the ongoing effort to make electronic devices more compact.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile