The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Feb. 26, 2024
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Inventors:
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 74/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 74/00 (2026.01); H10W 90/724 (2026.01);
Abstract
An electronic package and a manufacturing method thereof are provided, in which a groove space for accommodating an electronic element is formed on a wiring structure, and an encapsulation layer is formed on the wiring structure to cover the electronic element. Via the design of the groove space, the overall thickness of the electronic package can be easily thinned to meet the demand for miniaturization.