This inventor holds 2 USPTO granted patents and 6 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chung-Chih Yen and Electronic Package Innovation.
Introduction
Chung-Chih Yen is an inventor associated with Taichung, Taiwan. His work includes an invention focused on making electronic packages thinner to support the miniaturization of electronic devices.
Latest Patents
Yen is credited with 1 patent: “Electronic Package and Manufacturing Method Thereof.” The invention describes forming a groove in a wiring structure to accommodate an electronic element, then covering the element with an encapsulation layer. This design can reduce the package’s overall thickness and help meet miniaturization requirements.
Career Highlights
Yen is associated with Siliconware Precision Industries, Ltd. His patent reflects work on electronic packaging structures and manufacturing methods.
Collaborations
The provided information identifies Chun-Chu Lai and Kuo-Hui Wan as Yen’s coworkers. Their names are included here as professional associations; no specific joint work on this patent was provided.
Conclusion
Chung-Chih Yen’s patent presents a practical approach to reducing electronic package thickness through a grooved wiring structure, contributing to the broader goal of device miniaturization.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile