This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Kuo-Hui Wan and His Electronic Package Invention.
Introduction
Kuo-Hui Wan is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. His patent work includes an electronic package design intended to support thinner, more compact electronic devices.
Latest Patents
Wan’s listed patent, “Electronic Package and Manufacturing Method Thereof,” describes a wiring structure with a groove that accommodates an electronic element. An encapsulation layer covers the element and wiring structure. The groove-based design helps reduce the package’s overall thickness to meet miniaturization needs. Wan is listed with 1 patent.
Career Highlights
Wan’s listed invention focuses on electronic packaging and its manufacturing process. The design addresses the challenge of integrating electronic components into thinner packages.
Collaborations
Wan’s listed coworkers include Chung-Chih Yen and Chun-Chu Lai. His company affiliation is Siliconware Precision Industries, Ltd.
Conclusion
Kuo-Hui Wan’s patent presents a groove-based electronic package design that supports thinner packaging and the broader goal of device miniaturization.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile