Taichung, Taiwan

Yu-Lung Huang

USPTO Granted Patents = 16 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Taichung, KR (2021)
  • Taichung, TW (2020 - 2024)

Company Filing History:


Years Active: 2020-2025

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16 patents (USPTO):Explore Patents

Title: Innovations by Yu-Lung Huang

Introduction

Yu-Lung Huang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 16 patents. His work focuses on improving heat dissipation and structural integrity in electronic components.

Latest Patents

One of his latest patents is an electronic package and manufacturing method that features a heat dissipation structure on a carrier. This design creates a packaging space for electronic components, ensuring they are completely encapsulated by a heat dissipation material. This innovation prevents exposure of the components, thereby enhancing the heat dissipation effect. Another notable patent involves an electronic package where a circuit board and a circuit block are embedded in an encapsulating layer, maintaining a distance between them. This design allows for separate current conduction paths, preventing overheating and warpage of the circuit board while improving the structural strength of the encapsulating layer.

Career Highlights

Yu-Lung Huang is associated with Siliconware Precision Industries Co., Ltd., a company known for its advancements in semiconductor packaging technology. His work has been instrumental in developing solutions that address common challenges in electronic packaging.

Collaborations

He has collaborated with notable coworkers, including Chang-Fu Lin and Chee-Key Chung, contributing to various innovative projects within the company.

Conclusion

Yu-Lung Huang's contributions to electronic packaging technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the challenges faced in electronic component design and manufacturing.

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