The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Jun. 23, 2020
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Wei-Jhen Chen, Taichung, TW;
Yu-Lung Huang, Taichung, TW;
Chee-Key Chung, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Yuan-Hung Hsu, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/31 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01);
Abstract
An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.