The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Aug. 03, 2021
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Yu-Lung Huang, Taichung, TW;
Chih-Ming Huang, Taichung, TW;
Kuo-Hua Yu, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.