The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Dec. 12, 2023
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Yu-Lung Huang, Taichung, TW;

Chee-Key Chung, Taichung, TW;

Yuan-Hung Hsu, Taichung, TW;

Chi-Jen Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/76804 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01);
Abstract

An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.


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