The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Aug. 06, 2019
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Yu-Lung Huang, Taichung, KR;
Chee-Key Chung, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Kuo-Hua Yu, Taichung, TW;
Wen-Shan Tsai, Taichung, TW;
En-Li Lin, Taichung, TW;
Kaun-I Cheng, Taichung, TW;
Wei-Ping Wang, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); F28F 13/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); F28F 13/18 (2013.01); H01L 21/4882 (2013.01); H01L 23/562 (2013.01);
Abstract
An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.