This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2015-2025.
Company Filing History:
Years Active: 2015-2025
Title: Kaun-I Cheng: Innovator in Electronic Packaging
Introduction
Kaun-I Cheng is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 8 patents. His innovative methods have advanced the technology used in electronic components, ensuring better performance and reliability.
Latest Patents
Cheng's latest patents include a method for fabricating electronic packages. This method involves disposing an electronic component on a substrate, forming an encapsulant layer to encapsulate the component, and creating a shielding layer made of metal on the encapsulant layer. Notably, the shielding layer features an extending portion that reaches the lateral side of the substrate along the corner of the encapsulant layer, without extending to the lower side of the substrate. This design prevents the shielding layer from contacting conductive pads on the lower side, thereby avoiding potential short circuits.
Career Highlights
Kaun-I Cheng is currently employed at Siliconware Precision Industries Co., Ltd. His work has been instrumental in developing advanced electronic packaging solutions that enhance the functionality and safety of electronic devices.
Collaborations
Cheng has collaborated with notable colleagues, including Wei-Ping Wang and Shu-Chi Chang, who have contributed to his innovative projects and research endeavors.
Conclusion
Kaun-I Cheng's contributions to electronic packaging through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the development of reliable electronic components.