The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

May. 09, 2018
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Yue-Ying Jian, Taichung, TW;

Wei-Ping Wang, Taichung, TW;

Tsung-Ming Li, Taichung, TW;

En-Li Lin, Taichung, TW;

Kaun-I Cheng, Taichung, TW;

Yu-De Chu, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.


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