Taichung, Taiwan

Wei-Ping Wang


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2015-2025

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9 patents (USPTO):Explore Patents

Title: Wei-Ping Wang: Innovator in Electronic Packaging

Introduction

Wei-Ping Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 9 patents. His innovative approaches have paved the way for advancements in the design and fabrication of electronic components.

Latest Patents

Among his latest patents, Wei-Ping Wang has developed a method for fabricating electronic packages. This method involves disposing an electronic component on a substrate, forming an encapsulant layer to encapsulate the component, and creating a shielding layer made of metal on the encapsulant layer. Notably, the shielding layer features an extending portion that reaches the lateral side of the substrate along the corner of the encapsulant layer, without extending to the lower side of the substrate. This design effectively prevents the shielding layer from contacting conductive pads on the lower side, thereby avoiding potential short circuits.

Career Highlights

Wei-Ping Wang is associated with Siliconware Precision Industries Co., Ltd., where he continues to innovate in the electronic packaging sector. His work has been instrumental in enhancing the reliability and performance of electronic devices.

Collaborations

Throughout his career, Wei-Ping Wang has collaborated with notable colleagues, including Kaun-I Cheng and Pang-Chun Lin. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Wei-Ping Wang's contributions to electronic packaging demonstrate his commitment to advancing technology in this field. His innovative methods and collaborative spirit continue to influence the industry positively.

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