The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jan. 25, 2022
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Yu-Lung Huang, Taichung, TW;

Kuo-Hua Yu, Taichung, TW;

Chang-Fu Lin, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32221 (2013.01); H01L 2924/0635 (2013.01);
Abstract

A heat dissipation structure is provided and includes a heat dissipation body and an adjustment channel. A carrying area and an active area adjacent to the carrying area are defined on a surface of the heat dissipation body, the carrying area is used for applying a first heat dissipation material thereonto, and the adjustment channel is formed in the active area, where one end of the adjustment channel communicates with the outside of the heat dissipation structure, and the other end communicates with the carrying area. Therefore, when the heat dissipation body is coupled to the electronic component by the first heat dissipation material, the adjustment channel can adjust a volume of the first heat dissipation material.


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