The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Jun. 06, 2023
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in an encapsulation layer, and a circuit structure is disposed on the encapsulation layer and electrically connected to the first electronic element and the second electronic element. The circuit structure has a hollow area corresponding to the first electronic element, and a heat dissipation structure is disposed in the hollow area to thermally connect the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation structure, so as to avoid the problem of affecting the operation of the second electronic element due to the overheating of the encapsulation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile