Taichung, Taiwan

Wen-Jung Tsai

This inventor holds 25 USPTO granted patents and 31 published patent applications, primarily in Electronic Packaging. Top assignees: Siliconware Precision Industries Co., Ltd., Siliconware Precision Industries, Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Jung Tsai. Retrieved from https://idiyas.com/inventor/wen-jung-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 96.0

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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Areas of Expertise:
Electronic Package
Manufacturing Method
Antenna Module
Conductive Posts
Interposer
Shielding Part
Fabrication Method
Packaging Structure
Semiconductor Block
Magnetized Layer
Antenna Function
Lead Frame
25 patents (USPTO):Explore Patents

Title: An Overview of Inventor Wen-Jung Tsai

Introduction

Wen-Jung Tsai, based in Taichung, Taiwan, is an accomplished inventor with a significant portfolio consisting of 18 patents. His innovative contributions primarily focus on advancements in electronic packaging technologies that enhance the functionality and integration of electronic components.

Latest Patents

Tsai's recent patents demonstrate his expertise in electronic packaging solutions. One notable patent is for an electronic package and manufacturing method wherein the design incorporates at least one electronic element alongside conductive structures strategically arranged on a carrier structure. This includes an encapsulation layer that protects key components while allowing for external connectivity as per functional requirements.

Another important patent details an electronic package utilizing a lead frame with multiple conductive posts. This design involves positioning an electronic element and the lead frame on a carrier structure featuring antenna functionality, and subsequently encapsulating them with a specialized encapsulant. The innovation allows end surfaces of the conductive posts to remain accessible for electrical connections, optimizing performance and integration.

Career Highlights

Wen-Jung Tsai works at Siliconware Precision Industries Co., Ltd., a company renowned for its cutting-edge semiconductor packaging solutions. His role in advancing electronic packaging is pivotal to the firm's success in the competitive tech landscape.

Collaborations

Throughout his career, Tsai has collaborated with talented colleagues, including Chih-Hsien Chiu and Chia-Yang Chen. These collaborations have facilitated the development of innovative solutions in electronic packaging, enhancing the creativity and efficiency of their projects.

Conclusion

Wen-Jung Tsai's contributions to the field of electronics through his patents are significant. His innovative designs continue to influence advancements in electronic packaging, propelling both his career and Siliconware Precision Industries Co., Ltd. to the forefront of technology. As the demand for more efficient and compact electronic devices grows, Tsai's work will likely remain at the cutting edge of industry innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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