The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Jan. 13, 2022
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Ko-Wei Chang, Taichung, TW;
Wen-Jung Tsai, Taichung, TW;
Che-Wei Yu, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.