Chia-Yang Chen

This inventor holds 28 USPTO granted patents and 15 published patent applications, primarily in Electronic Packaging. Top assignees: Siliconware Precision Industries Co., Ltd., Siliconware Precision Industries, Ltd., Universal Scientific Industrial Co., Ltd.. Active years: 2009-2026.

USPTO Granted Patents = 28 (Patent Applications = 15)

% Patents Active = 96.4

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 34(Granted Patents)

Location History:

Taichung Hsien, TW (2016)
Taichung, TW (2009 - 2024)

Company Filing History:

25 out of 826

Siliconware Precision Industries Co., Ltd.

patents

2 out of 30

Siliconware Precision Industries, Ltd.

patents

1 out of 75

Universal Scientific Industrial Co., Ltd.

patents

Years Active: 2009-2026

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Areas of Expertise:

Electronic Package

Semiconductor Package

Manufacturing Method

Shielding Member

Conductive Pillars

Antenna Structure

Wireless Communication

Fabrication Method

Carrier-Free Package

Circuit Board

Metal Layer

Package Structure

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685173 - Electronic package and shielding part including semiconductor block and magnetized layer (2026-07-14),

2. 12672547 - Electronic package and manufacturing method thereof (2026-06-30),

3. 12500181 - Electronic package and manufacturing method thereof (2025-12-16),

4. 12211776 - Electronic package and manufacturing method thereof (2025-01-28),

5. 12100641 - Electronic package and method for manufacturing the same (2024-09-24),

6. 12057409 - Electronic package and manufacturing method thereof (2024-08-06),

7. 11764162 - Electronic package and method for manufacturing the same (2023-09-19),

8. 11749583 - Electronic package and method for manufacturing the same (2023-09-05),

9. 11723144 - Electronic device and circuit board thereof (2023-08-08),

10. 11222852 - Method for fabricating electronic package (2022-01-11),

11. 11069633 - Electronic package (2021-07-20),

12. 10916526 - Method for fabricating electronic package with conductive pillars (2021-02-09),

13. 10643974 - Electronic package with conductive pillars (2020-05-05),

14. 10461041 - Electronic package and method for fabricating the same (2019-10-29),

15. 10410970 - Electronic package and method for fabricating the same (2019-09-10),

Title: Chia-Yang Chen: Pioneering Inventor from Taichung

Introduction: Chia-Yang Chen is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chia-Yang Chen holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chen has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Chia-Yang Chen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: Chia-Yang Chen's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and pave the way for a brighter tomorrow.