Siliconware Precision Industries Co., Ltd.

Universal Scientific Industrial Co., Ltd.

Chia-Yang Chen

Chih-Hsien Chiu

Hsin-Lung Chung

Ming-Fan Tsai

Chao-Ya Yang

Tsung-Hsien Tsai

Wen-Jung Tsai

Cho-Hsin Chang

Chien-Cheng Lin

Ko-Wei Chang

Chih-Chiang He

Chih-Wei Chen

Chun-Chi Ke

Heng-Cheng Chu

Ying-Wei Lu

Chi-Liang Shih

Te-Fang Chu

Hao-Ju Fang

Jyun-Yuan Jhang

Ching-Hua Chen

Siang-Yu Lin

Yude Chu

Kuan-Hsing Li

Tsung-Hsien Hsu

Yu-Wei Yeh

Chi-Pin Tsai

Chih-Ming Cheng

Sheng-Ming Yang

Hung-Cheng Chen

Shun-Yu Chien

Che-Wei Yu

An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.

Electronic package and manufacturing method thereof

Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Electronic package and method for manufacturing the same

An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

Electronic device and circuit board thereof

An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

Method for fabricating electronic package

The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

Electronic package

A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

Method for fabricating electronic package with conductive pillars

An electronic package includes a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

Electronic package with conductive pillars

Electronic package and method for fabricating the same

An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.

An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

Growing community of inventors

Taichung, Taiwan

Chia-Yang Chen