The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Aug. 19, 2020
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Ming-Fan Tsai, Taichung, TW;
Chih-Wei Chen, Taichung, TW;
Tsung-Hsien Tsai, Taichung, TW;
Chao-Ya Yang, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.