The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
May. 10, 2024
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Inventors:
Chih-Hsien Chiu, Taichung City, TW;
Wen-Jung Tsai, Taichung City, TW;
Chien-Cheng Lin, Taichung City, TW;
Ko-Wei Chang, Taichung City, TW;
Yu-Wei Yeh, Taichung City, TW;
Shun-Yu Chien, Taichung City, TW;
Chia-Yang Chen, Taichung City, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 42/00 (2026.01); H10W 42/20 (2026.01); H10W 70/685 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10W 70/685 (2026.01); H10W 74/114 (2026.01);
Abstract
An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer.