This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yu-Wei Yeh: Inventor in Electronic Packaging
Introduction
Yu-Wei Yeh is an inventor based in Taichung, Taiwan. His patent work concerns electronic packaging and manufacturing methods.
Latest Patents
Yeh is associated with 1 patent, titled “Electronic Package and Manufacturing Method Thereof.” The invention describes an electronic component arranged on a wiring structure and covered by a packaging layer. A frame body is embedded in the packaging layer without contacting the wiring structure.
Career Highlights
Yeh is associated with Siliconware Precision Industries, Ltd. His patent reflects work on electronic package structures and their manufacture.
Collaborations
The available information connects Yeh’s patent and professional affiliation with Siliconware Precision Industries, Ltd. It does not specify additional collaborators.
Conclusion
Yu-Wei Yeh’s documented invention focuses on an electronic package design that embeds a non-contacting frame body within its packaging layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile