The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Jan. 10, 2022
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Chih-Hsien Chiu, Taichung, TW;
Wen-Jung Tsai, Taichung, TW;
Chien-Cheng Lin, Taichung, TW;
Ko-Wei Chang, Taichung, TW;
Yu-Wei Yeh, Taichung, TW;
Shun-Yu Chien, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01);
Abstract
An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.