Company Filing History:
Years Active: 2020-2024
Title: Innovations of Yu-Wei Yeh
Introduction
Yu-Wei Yeh is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on improving the reliability and efficiency of electronic components through innovative packaging methods.
Latest Patents
Yu-Wei Yeh's latest patents include an electronic package and a manufacturing method thereof. This invention involves arranging an electronic component on a wiring structure, which is then covered with a packaging layer. A frame body is embedded in the packaging layer, ensuring it does not contact the wiring structure or cover the electronic component. Another notable patent is an electronic package that utilizes a plurality of bonding wires as a shielding structure. These bonding wires are stitch bonded onto a carrier that holds electronic components, effectively preventing issues related to the shielding structure peeling off or falling off due to environmental factors such as temperature and humidity.
Career Highlights
Yu-Wei Yeh is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic packaging technology.
Collaborations
Some of Yu-Wei Yeh's notable coworkers include Chih-Hsien Chiu and Wen-Jung Tsai. Their collaboration has fostered a creative environment that encourages the development of cutting-edge technologies in the field.
Conclusion
Yu-Wei Yeh's contributions to electronic packaging through his patents demonstrate his commitment to innovation and excellence in the industry. His work continues to influence the development of reliable electronic components, showcasing the importance of effective packaging solutions.