logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11532568 B1

PDFFull Text
Date of Patent:
Dec. 20, 2022

Filed:

Jul. 16, 2020

Electronic package

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung, TW;

Wen-Jung Tsai, Taichung, TW;

Yu-Wei Yeh, Taichung, TW;

Tsung-Hsien Tsai, Taichung, TW;

Chi-Liang Shih, Taichung, TW;

Sheng-Ming Yang, Taichung, TW;

Ping-Hung Liao, Taichung, TW;

Assignee:

SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;

Attorney:

Kelly & Kelley, LLP

Primary Examiner:

Michele Fan

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Find Patent Forward Citations

Chiu, Chih-Hsien. (2022). Electronic package (U.S. Patent No. 11532568). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11532568

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…