Taichung, Taiwan

Chi-Liang Shih

USPTO Granted Patents = 7 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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7 patents (USPTO):Explore Patents

Title: The Innovations of Chi-Liang Shih

Introduction

Chi-Liang Shih is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronics, holding a total of 7 patents. His work focuses on enhancing electronic packaging and modules, which are crucial for modern technology.

Latest Patents

One of his latest patents is an electronic package that utilizes a plurality of bonding wires as a shielding structure. This innovative design ensures that the bonding wires are stitch bonded onto a carrier carrying electronic components. This approach effectively prevents the shielding structure from peeling off or falling off due to environmental factors such as temperature and humidity. Another notable patent is for an electronic module that includes a substrate, an antenna body disposed over the substrate, and an encapsulant that encapsulates the antenna body. This design allows for an increased arrangement area of the antenna body without enlarging the substrate, thus meeting the miniaturization requirements of modern electronics.

Career Highlights

Chi-Liang Shih is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work at this company has allowed him to push the boundaries of electronic design and innovation.

Collaborations

He has collaborated with notable coworkers such as Te-Fang Chu and Chih-Hsien Chiu, contributing to various projects that enhance the functionality and efficiency of electronic devices.

Conclusion

Chi-Liang Shih's contributions to the field of electronics through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the development of advanced electronic packaging and modules, paving the way for future innovations.

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