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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10074621 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Jun. 14, 2016

Electronic package with antenna structure

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung, TW;

Chi-Pin Tsai, Taichung, TW;

Chi-Liang Shih, Taichung, TW;

Ming-Fan Tsai, Taichung, TW;

Chia-Yang Chen, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Cory Eskridge

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 24/49 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

Find Patent Forward Citations

Chiu, Chih-Hsien. (2018). Electronic package with antenna structure (U.S. Patent No. 10074621). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10074621

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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