The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Apr. 18, 2014
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chi-Liang Shih, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Te-Fang Chu, Taichung, TW;
Sheng-Ming Yang, Taichung, TW;
Hung-Cheng Chen, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.