Siliconware Precision Industries Co., Ltd.

Chi-Liang Shih

Te-Fang Chu

Chih-Hsien Chiu

Hsin-Lung Chung

Chia-Yang Chen

Chun-Chong Chien

Sheng-Ming Yang

Tsung-Hsien Tsai

Wen-Jung Tsai

Ming-Fan Tsai

Hao-Ju Fang

Yu-Wei Yeh

Chi-Pin Tsai

Kuang-Neng Chung

Ping-Hung Liao

Hsin-Lung Chun

Hung-Cheng Chen

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Electronic package

An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.

Electronic module

An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Method for fabricating electronic package

Electronic package and fabrication method thereof

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

Electronic package with antenna structure

A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.

Package structure and fabrication method thereof

A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Semiconductor package and fabrication method thereof

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Taichung, Taiwan

Chi-Liang Shih