The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Nov. 20, 2018
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Yu-Wei Yeh, Taichung, TW;
Yen-Hung Lin, Taichung, TW;
Chih-Yi Liao, Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.