The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Dec. 08, 2022
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/552 (2013.01); H01L 25/105 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01);
Abstract
An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.