Taichung, Taiwan

Chi-Ching Ho

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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17 patents (USPTO):Explore Patents

Title: Innovations of Chi-Ching Ho

Introduction

Chi-Ching Ho is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 16 patents. His work focuses on improving the reliability and efficiency of electronic components through innovative designs and manufacturing methods.

Latest Patents

Chi-Ching Ho's latest patents include an electronic package and manufacturing method that addresses stress concentration issues in substrate structures. This invention involves an electronic module and at least one support member placed on a substrate structure with a circuit layer. The design effectively disperses stress through the support member, preventing warping of the substrate. Another notable patent is an electronic package that features a circuit structure with auxiliary circuit layers. This design allows for an electronic component to be electrically connected to these auxiliary layers, enhancing the overall functionality of the package.

Career Highlights

Chi-Ching Ho has built a successful career at Siliconware Precision Industries Co., Ltd., where he has been instrumental in advancing electronic packaging technologies. His innovative approaches have led to numerous patents that contribute to the company's reputation as a leader in the industry.

Collaborations

Chi-Ching Ho has collaborated with talented individuals such as Yi-Min Fu and Yu-Po Wang, who have contributed to his projects and innovations. Their teamwork has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chi-Ching Ho's contributions to electronic packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.

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