The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jan. 10, 2022
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Chao-Chiang Pu, Taichung, TW;
Chi-Ching Ho, Taichung, TW;
Yi-Min Fu, Taichung, TW;
Yu-Po Wang, Taichung, TW;
Po-Yuan Su, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4882 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01); H01L 23/585 (2013.01); H01L 23/42 (2013.01); H05K 1/0203 (2013.01);
Abstract
An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.