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Yu-Po Wang

This inventor holds 34 USPTO granted patents and 25 published patent applications, primarily in Semiconductor Packaging. Top assignees: Siliconware Precision Industries Co., Ltd., Winbond Electronics Corporation. Active years: 2003-2025.

USPTO Granted Patents = 34 (Patent Applications = 25)

% Patents Active = 91.2

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 251(Granted Patents)

Location History:

Miaoli, TW (2003 - 2011)
Taichung Hsien, TW (2007 - 2014)
Pingtung, TW (2023)
Taichung, TW (2004 - 2024)

Company Filing History:

32 out of 826

Siliconware Precision Industries Co., Ltd.

patents

2 out of 2,103

Winbond Electronics Corporation

patents

Years Active: 2003-2025

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Areas of Expertise:

Electronic Package

Semiconductor Structure

Fabrication Method

Stacked Semiconductor

Memory Structure

Cavity-Down Package

Chip-On-Chip Module

Landless Conductive Traces

Thermal Management

Multi-Chip Module

Packaging Substrate

Heat Spreader

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438094 - Electronic package and manufacturing method thereof (2025-10-07),

2. 12412820 - Electronic package and manufacturing method thereof (2025-09-09),

3. 12412819 - Electronic package and manufacturing method thereof (2025-09-09),

4. 12334452 - Electronic package and manufacturing method thereof (2025-06-17),

5. 12199047 - Electronic package and manufacturing method thereof (2025-01-14),

6. 12193221 - Semiconductor structure and method for forming the same (2025-01-07),

7. 12176291 - Electronic package and manufacturing method thereof (2024-12-24),

8. 12051641 - Electronic package and manufacturing method thereof (2024-07-30),

9. 11631675 - Semiconductor memory structure and method for forming the same (2023-04-18),

10. 9356008 - Semiconductor package and fabrication method thereof (2016-05-31),

11. 9269677 - Fabrication method of packaging substrate (2016-02-23),

12. 8901729 - Semiconductor package, packaging substrate and fabrication method thereof (2014-12-02),

13. 8304665 - Package substrate having landless conductive traces (2012-11-06),

14. 8207620 - Flip-chip semiconductor package and chip carrier for preventing corner delamination (2012-06-26),

15. 8183092 - Method of fabricating stacked semiconductor structure (2012-05-22),

Title: The Innovative Journey of Inventor Yu-Po Wang

Introduction: Yu-Po Wang, a talented inventor hailing from Taichung Hsien, TW, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Yu-Po Wang's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable health monitoring device that has the potential to transform the healthcare industry.

Career Highlights: Throughout his illustrious career, Yu-Po Wang has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have garnered international acclaim and have been instrumental in shaping the future of various industries.

Collaborations: Yu-Po Wang has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly with teams of experts from diverse backgrounds has been key to the success of his projects.

Conclusion: In conclusion, Yu-Po Wang stands as a shining example of a visionary inventor who continues to drive innovation forward with his creative solutions and groundbreaking ideas. His passion for technology and commitment to excellence make him a true pioneer in the world of inventions.

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