The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Nov. 07, 2008
Chiang-cheng Chang, Taichung Hsien, TW;
Yen-ping Wang, Taichung Tsien, TW;
Don-son Jiang, Taichung Hsien, TW;
Jeng-yuan Lai, Taichung Hsien, TW;
Yu-po Wang, Taichung, TW;
Chiang-Cheng Chang, Taichung Hsien, TW;
Yen-Ping Wang, Taichung Tsien, TW;
Don-Son Jiang, Taichung Hsien, TW;
Jeng-Yuan Lai, Taichung Hsien, TW;
Yu-Po Wang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package substrate having landless conductive traces is proposed, which includes a core layer with a plurality of plated through holes formed therein, and a plurality of conductive traces formed on at least a surface of the core layer. Each of the conductive traces has a connection end, a bond pad end, and a base body connecting the connection end and the bond pad end, the conductive trace is electrically connected to a corresponding one of the plated through holes through the connection end, and the connection end has a width greater than that of the base body but not greater than the diameter of the plated through hole, thereby increasing the contact area between the conductive trace and the plated through hole and preventing the contact surface of the conductive trace with the plated through hole from cracking.