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For the Inventor, By the Inventor

Taichung, Taiwan

Chiang-Cheng Chang

USPTO Granted Patents = 11 

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 32(Granted Patents)


Location History:

  • Tiachung, TW (2012)
  • Taichung Hsien, TW (2012)
  • Taichung, TW (2013 - 2018)

Company Filing History:

goldMedal11 out of 823 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2012-2018

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11 patents (USPTO):Explore Patents
1. 10049955 - Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer (2018-08-14),
2. 9899237 - Carrier, semiconductor package and fabrication method thereof (2018-02-20),
3. 9812340 - Method of fabricating semiconductor package having semiconductor element (2017-11-07),
4. 9324585 - Semiconductor package and method of fabricating the same (2016-04-26),
5. 9041189 - Semiconductor package and method of fabricating the same (2015-05-26),
6. 9040361 - Chip scale package with electronic component received in encapsulant, and fabrication method thereof (2015-05-26),
7. 8766456 - Method of fabricating a semiconductor package (2014-07-01),
8. 8680692 - Carrier, semiconductor package and fabrication method thereof (2014-03-25),
9. 8525348 - Chip scale package and fabrication method thereof (2013-09-03),
10. 8334174 - Chip scale package and fabrication method thereof (2012-12-18),
11. 8304665 - Package substrate having landless conductive traces (2012-11-06),

Title: Innovations of Chiang-Cheng Chang

Introduction

Chiang-Cheng Chang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His work focuses on innovative fabrication methods that enhance the reliability and efficiency of semiconductor packages.

Latest Patents

One of his latest patents is a fabrication method of wafer level packaging semiconductor package with a sandwich structure of support plate isolation layer and bonding layer. This method includes several steps, such as forming a release layer on a carrier with concave portions, disposing chips on the release layer, and forming an encapsulant on the chips. The invention aims to avoid warpage during thermal cycles caused by incompatible coefficients of thermal expansion (CTEs).

Another notable patent is the carrier, semiconductor package, and fabrication method thereof. This method also involves providing a carrier with a concave portion and a releasing layer, disposing a chip on the releasing layer, and forming an encapsulant. The design of the concave portion facilitates chip alignment, improving product reliability.

Career Highlights

Chiang-Cheng Chang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing semiconductor packaging technologies. His innovative approaches have garnered attention in the industry, contributing to the company's reputation for excellence.

Collaborations

Chiang-Cheng Chang has collaborated with notable coworkers, including Shih-Kuang Chiu and Meng-Tsung Lee. Their combined expertise has led to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Chiang-Cheng Chang's contributions to semiconductor packaging through his innovative patents and collaborative efforts have significantly impacted the industry. His work continues to pave the way for advancements in technology and product reliability.

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