The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Feb. 07, 2014
Siliconware Precision Industries Co., Ltd, Taichung, TW;
Chiang-Cheng Chang, Taichung, TW;
Meng-Tsung Lee, Taichung, TW;
Jung-Pang Huang, Taichung, TW;
Shih-Kuang Chiu, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.