Shih-Kuang Chiu

This inventor holds 42 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Kuang Chiu. Retrieved from https://idiyas.com/inventor/shih-kuang-chiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 42 (Patent Applications = 13)

% Patents Active = 83.3

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 334(Granted Patents)

Location History:

Taichung Hsien, TW (2005 - 2014)
Taichung, TW (2002 - 2021)

Company Filing History:

42 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2002-2021

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Areas of Expertise:

Electrical Testing

Interposer

Fabrication Method

Wafer Level Packaging

Semiconductor Device

MEMS Elements

Chip Scale Package

Heat Sink

Flip-Chip Bonding

Carrier

Package Structure

Micro-Electromechanical

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10950507 - Electrical testing method of interposer (2021-03-16),

2. 10615055 - Method for fabricating package structure (2020-04-07),

3. 10199239 - Package structure and fabrication method thereof (2019-02-05),

4. 10049955 - Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer (2018-08-14),

5. 9991178 - Interposer and electrical testing method thereof (2018-06-05),

6. 9899308 - Semiconductor package and method of fabricating the same (2018-02-20),

7. 9899237 - Carrier, semiconductor package and fabrication method thereof (2018-02-20),

8. 9875981 - Semiconductor device having conductive vias (2018-01-23),

9. 9812340 - Method of fabricating semiconductor package having semiconductor element (2017-11-07),

10. 9659806 - Semiconductor package having conductive pillars (2017-05-23),

11. 9607939 - Semiconductor package and method of fabricating the same (2017-03-28),

12. 9520304 - Semiconductor package and fabrication method thereof (2016-12-13),

13. 9502333 - Semiconductor device having conductive vias (2016-11-22),

14. 9487393 - Fabrication method of wafer level package having a pressure sensor (2016-11-08),

15. 9425119 - Package structure and fabrication method thereof (2016-08-23),

Title: The Innovative Journey of Shih-Kuang Chiu

Introduction: Shih-Kuang Chiu is a pioneering inventor hailing from Taichung, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shih-Kuang Chiu holds several patents in the realm of electronics and semiconductor technology, showcasing her continuous dedication to pushing the boundaries of what is possible in the industry.

Career Highlights: With a career spanning over two decades, Shih-Kuang Chiu has worked with some of the leading tech companies, where she has played a pivotal role in developing cutting-edge technologies that have revolutionized the way we interact with electronics.

Collaborations: Throughout her career, Shih-Kuang Chiu has collaborated with top researchers, engineers, and designers, fostering a culture of innovation and excellence in all her projects. Her collaborative spirit has led to the creation of numerous successful products and solutions.

Conclusion: Shih-Kuang Chiu's passion for innovation, coupled with her relentless drive to create, has solidified her position as a trailblazer in the world of technology. Her work continues to inspire future generations of inventors and innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

13 patents pending: