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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9487393 B1

PDFFull Text
Date of Patent:
Nov. 08, 2016

Filed:

Aug. 07, 2015

Fabrication method of wafer level package having a pressure sensor

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Hong-Da Chang, Taichung, TW;

Hsin-Yi Liao, Taichung, TW;

Chun-An Huang, Taichung, TW;

Shih-Kuang Chiu, Taichung, TW;

Chien-An Chen, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

William Harriston

Int. Cl.
CPC ...
H01L 29/00 (2006.01); B81C 1/00 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); B81C 1/00269 (2013.01); H01L 29/84 (2013.01); B81B 2201/0264 (2013.01); B81C 2203/0154 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.

Find Patent Forward Citations

Chang, Hong-Da. (2016). Fabrication method of wafer level package having a pressure sensor (U.S. Patent No. 9487393). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9487393

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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