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For the Inventor, By the Inventor

Taichung, Taiwan

Hsin-Yi Liao

This inventor holds 20 USPTO granted patents and 4 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2012-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsin-Yi Liao. Retrieved from https://idiyas.com/inventor/hsin-yi-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 70.0

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 49(Granted Patents)


Location History:

  • Taichung Hsien, TW (2013 - 2014)
  • Taichung, TW (2012 - 2021)

Company Filing History:

goldMedal20 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2012-2021

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20 patents (USPTO):Explore Patents
1. 11195812 - Method for fabricating an encapsulated electronic package using a supporting plate (2021-12-07),
2. 11114412 - Electronic package and method for fabricating the same (2021-09-07),
3. 9487393 - Fabrication method of wafer level package having a pressure sensor (2016-11-08),
4. 9254994 - Package structure having MEMS element (2016-02-09),
5. 9133021 - Wafer level package having a pressure sensor and fabrication method thereof (2015-09-15),
6. 9117698 - Fabrication method of semiconductor package (2015-08-25),
7. 9040361 - Chip scale package with electronic component received in encapsulant, and fabrication method thereof (2015-05-26),
8. 8878356 - Package structure having micro-electro-mechanical system element and method of fabrication the same (2014-11-04),
9. 8866236 - Package structure having MEMS element (2014-10-21),
10. 8829672 - Semiconductor package, package structure and fabrication method thereof (2014-09-09),
11. 8766456 - Method of fabricating a semiconductor package (2014-07-01),
12. 8741693 - Method for manufacturing package structure with micro-electromechanical element (2014-06-03),
13. 8716070 - Fabrication method of package structure having MEMS element (2014-05-06),
14. 8633048 - Method for fabricating package structure having MEMS elements (2014-01-21),
15. 8610272 - Package structure with micro-electromechanical element and manufacturing method thereof (2013-12-17),

Title: Inventor Hsin-Yi Liao: Revolutionizing Technology in Taichung

Introduction: Hsin-Yi Liao is a pioneering inventor based in Taichung, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Hsin-Yi Liao holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Hsin-Yi Liao has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout her career, Hsin-Yi Liao has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and creativity that has led to the development of cutting-edge products and solutions.

Conclusion: Hsin-Yi Liao's passion for innovation and her relentless pursuit of excellence have solidified her reputation as a trailblazer in the world of technology, inspiring future generations to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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