The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Apr. 20, 2011
Hong-da Chang, Taichung, TW;
Hsin-yi Liao, Taichung, TW;
Chun-an Huang, Taichung, TW;
Shih-kuang Chiu, Taichung, TW;
Chien-an Chen, Taichung, TW;
Hong-Da Chang, Taichung, TW;
Hsin-Yi Liao, Taichung, TW;
Chun-An Huang, Taichung, TW;
Shih-Kuang Chiu, Taichung, TW;
Chien-An Chen, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.