logo

For the Inventor, By the Inventor

Taichung, Taiwan

Hong-Da Chang

This inventor holds 17 USPTO granted patents and 3 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hong-Da Chang. Retrieved from https://idiyas.com/inventor/hong-da-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 82.4

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Taichung Hsien, TW (2013 - 2014)
  • Taichung, TW (2015 - 2024)

Company Filing History:

goldMedal17 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2013-2024

Loading Chart...
17 patents (USPTO):Explore Patents
1. 12125828 - Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same (2024-10-22),
2. 11923337 - Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same (2024-03-05),
3. 11676877 - Electronic package with multiple electronic components spaced apart by grooves (2023-06-13),
4. 11600571 - Electronic package, packaging substrate, and methods for fabricating the same (2023-03-07),
5. 11398413 - Electronic package with multiple electronic components spaced apart by grooves (2022-07-26),
6. 10903167 - Electronic package, packaging substrate, and methods for fabricating the same (2021-01-26),
7. 9659806 - Semiconductor package having conductive pillars (2017-05-23),
8. 9607974 - Package structure and fabrication method thereof (2017-03-28),
9. 9520304 - Semiconductor package and fabrication method thereof (2016-12-13),
10. 9502335 - Package structure and method for fabricating the same (2016-11-22),
11. 9487393 - Fabrication method of wafer level package having a pressure sensor (2016-11-08),
12. 9425119 - Package structure and fabrication method thereof (2016-08-23),
13. 9133021 - Wafer level package having a pressure sensor and fabrication method thereof (2015-09-15),
14. 8878356 - Package structure having micro-electro-mechanical system element and method of fabrication the same (2014-11-04),
15. 8633048 - Method for fabricating package structure having MEMS elements (2014-01-21),

Title: Inventor Hong-Da Chang: Revolutionizing Technology in Taichung

Introduction: Hong-Da Chang is a visionary inventor based in Taichung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Hong-Da Chang holds several patents in the areas of artificial intelligence, renewable energy, and sustainable transportation, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Chang has worked with leading tech companies to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Hong-Da Chang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Hong-Da Chang's relentless pursuit of innovation and his passion for creating a better future through technology make him a true pioneer in the field of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…