Yen-Ping Wang

Title: Innovations of Yen-Ping Wang

Introduction

Yen-Ping Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to electronic components.

Latest Patents

One of his latest patents is titled "Semiconductor device and fabrication method thereof." This invention involves a semiconductor structure that includes a chip, multiple metal posts, and a buffer layer. The chip features a silicon-based layer with a build-up structure that consists of metal and low-k dielectric layers. This design reduces overall thermal stress by positioning the low-k dielectric layer away from the surface used for external connections.

Another patent is for a "Package substrate having landless conductive traces." This invention proposes a package substrate with a core layer containing plated through holes and conductive traces. The design enhances the contact area between the conductive trace and the plated through hole, preventing cracking and ensuring reliable electrical connections.

Career Highlights

Yen-Ping Wang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop cutting-edge technologies that advance the semiconductor industry. His patents reflect his commitment to improving electronic device performance and reliability.

Collaborations

Yen-Ping Wang has collaborated with notable colleagues, including Chiang-Cheng Chang and Don-Son Jiang. These partnerships have contributed to the successful development of his innovative patents.

Conclusion

Yen-Ping Wang's contributions to semiconductor technology through his patents demonstrate his expertise and innovative spirit. His work continues to influence the industry and pave the way for future advancements in electronic components.