The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
May. 11, 2011
Hui-min Huang, Taichung, TW;
Chun-tang Lin, Taichung, TW;
Chien-wei Lee, Taichung, TW;
Yen-ping Wang, Taichung, TW;
Hui-Min Huang, Taichung, TW;
Chun-Tang Lin, Taichung, TW;
Chien-Wei Lee, Taichung, TW;
Yen-Ping Wang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor structure includes a chip, a plurality of metal posts disposed in the chip and a buffer layer disposed on the chip. The chip includes a silicon-based layer having opposite first and second surfaces, and a build-up structure formed on the first surface of the silicon-based layer consisting of at least a metal layer and a low-k dielectric layer alternatively stacked on one another. Each of the metal posts is disposed in the silicon-based layer with one end thereof electrically connected with the metal layer while the other end is exposed from the second surface of the silicon-based layer. The buffer layer is disposed on the build-up structure. By positioning the low-k dielectric layer far from the second surface that is used for connecting to an external electronic component, the present invention reduces the overall thermal stress.