Chun-Tang Lin

This inventor holds 35 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Tang Lin. Retrieved from https://idiyas.com/inventor/chun-tang-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35 (Patent Applications = 12)

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 31(Granted Patents)

Location History:

Taichung Hsien, TW (2014 - 2017)
Taichung, TW (2013 - 2024)

Company Filing History:

35 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2013-2024

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Areas of Expertise:

Chip Matching

Substrate Structure

Electronic Package

Fabrication Method

Conductive Via

Interposer Structure

Embedded Elements

Conductive Bump

Testing Semiconductor

Semiconductor Device

Chamfers

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12046494 - Chip matching system and method thereof (2024-07-23),

2. 11973014 - Method of manufacturing substrate structure with filling material formed in concave portion (2024-04-30),

3. 11532495 - Chip matching system and method thereof (2022-12-20),

4. 11527491 - Method for fabricating substrate structure (2022-12-13),

5. 11227842 - Electronic package and substrate structure having chamfers (2022-01-18),

6. 11056442 - Substrate structure, electronic package having the same, and method for fabricating the same (2021-07-06),

7. 10763223 - Substrate structure having chamfers (2020-09-01),

8. 10522453 - Substrate structure with filling material formed in concave portion (2019-12-31),

9. 10403567 - Fabrication method of electronic package (2019-09-03),

10. 9899303 - Electronic package and fabrication method thereof (2018-02-20),

11. 9842758 - Package structure and fabrication method thereof (2017-12-12),

12. 9754898 - Semiconductor package and fabrication method thereof (2017-09-05),

13. 9627226 - Fabrication method of semiconductor package (2017-04-18),

14. 9607974 - Package structure and fabrication method thereof (2017-03-28),

15. 9607941 - Conductive via structure and fabrication method thereof (2017-03-28),

Title: The Innovative Journey of Chun-Tang Lin

Introduction: Chun-Tang Lin, a pioneering inventor hailing from Taichung, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Chun-Tang Lin's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced automation and efficiency, as well as a cutting-edge medical device designed to improve patient care and treatment outcomes.

Career Highlights: With a career spanning over two decades, Chun-Tang Lin has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized globally, earning him prestigious awards in the field of technology and innovation.

Collaborations: Throughout his career, Chun-Tang Lin has collaborated with leading technology companies, research institutions, and universities to further advance his inventions and bring them to market. His collaborative spirit and dedication to excellence have led to the successful implementation of his groundbreaking ideas.

Conclusion: Chun-Tang Lin's passion for innovation and relentless pursuit of excellence have solidified his position as a trailblazing inventor in the world of technology. His contributions have not only transformed industries but have also improved the lives of people around the globe.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

12 patents pending: