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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11056442 B1

PDFFull Text
Date of Patent:
Jul. 06, 2021

Filed:

Jun. 15, 2017

Substrate structure, electronic package having the same, and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Po-Hao Wang, Taichung, TW;

Chun-Tang Lin, Taichung, TW;

Shou-Qi Chang, Taichung, TW;

Yu-Hsiang Hsieh, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Ahmed N Sefer

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.

Find Patent Forward Citations

Wang, Po-Hao. (2021). Substrate structure, electronic package having the same, and method for fabricating the same (U.S. Patent No. 11056442). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11056442

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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