The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jul. 20, 2007
Yuan-lin Tzeng, Taichung Hsien, TW;
Nai-hao Kao, Taichung Hsien, TW;
Jeng-yuan Lai, Taichung Hsien, TW;
Yu-po Wang, Taichung Hsien, TW;
Cheng-hsu Hsiao, Taichung Hsien, TW;
Yuan-Lin Tzeng, Taichung Hsien, TW;
Nai-Hao Kao, Taichung Hsien, TW;
Jeng-Yuan Lai, Taichung Hsien, TW;
Yu-Po Wang, Taichung Hsien, TW;
Cheng-Hsu Hsiao, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
The present invention discloses a flip-chip semiconductor package and a chip carrier thereof. The chip carrier includes a groove formed around a chip-mounting area. The groove may be formed along a periphery of the chip-mounting area or at corners thereof. The groove is filled with a filler of low Young's modulus so as to absorb and eliminate thermal stress, thereby preventing delamination between an underfill and a flip chip mounted on the chip-mounting area.