Yuan-Lin Tzeng

Title: Innovations of Yuan-Lin Tzeng

Introduction

Yuan-Lin Tzeng is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a flip-chip semiconductor package and a chip carrier designed to prevent corner delamination. This invention discloses a flip-chip semiconductor package that features a chip carrier with a groove formed around the chip-mounting area. The groove is filled with a filler of low Young's modulus, which absorbs and eliminates thermal stress, thereby preventing delamination between the underfill and the flip chip. Another patent involves a lead frame and a semiconductor package that includes a die pad for mounting semiconductor chips. This design improves the production yield by preventing breakage of the grounding wire due to thermal stress during high-temperature processes.

Career Highlights

Yuan-Lin Tzeng is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in the semiconductor industry. His work has contributed to advancements in packaging technology, enhancing the reliability and efficiency of semiconductor devices.

Collaborations

He has collaborated with notable coworkers, including Jeng-Yuan Lai and Ya-Yi Lai, who have also contributed to the field of semiconductor technology.

Conclusion

Yuan-Lin Tzeng's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to impact the industry positively.