Nai-Hao Kao

Title: Nai-Hao Kao: Innovator in Semiconductor Packaging

Introduction

Nai-Hao Kao is a prominent inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that address critical challenges in the industry. His work focuses on enhancing the reliability and performance of semiconductor devices.

Latest Patents

Nai-Hao Kao's latest patents include a flip-chip semiconductor package and a chip carrier designed to prevent corner delamination. This invention features a groove around the chip-mounting area, filled with a low Young's modulus filler to absorb thermal stress, thereby preventing delamination between the underfill and the flip chip. Another notable patent is the cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader. This design incorporates a substrate with a ground ring and ground vias, ensuring effective heat dissipation and minimizing electromagnetic interference.

Career Highlights

Nai-Hao Kao is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His innovative designs have contributed to advancements in semiconductor technology, making him a valuable asset to his organization.

Collaborations

Throughout his career, Nai-Hao Kao has collaborated with talented individuals such as Yu-Po Wang and Wen-Jung Chiang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Nai-Hao Kao's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry, ensuring improved performance and reliability in semiconductor devices.