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For the Inventor, By the Inventor

Taichung, Taiwan

Cheng-Hsu Hsiao

This inventor holds 58 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Hsu Hsiao. Retrieved from https://idiyas.com/inventor/cheng-hsu-hsiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 58 

% Patents Active = 67.2

Average Co-Inventor Count = 3.2

ph-index = 16

Forward Citations = 790(Granted Patents)

Forward Citations (Not Self Cited) = 761(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Nanto, TW (2010)
  • Nantou, TW (2002 - 2011)
  • Taichung Hsien, TW (2005 - 2014)
  • Taichung, TW (2004 - 2019)

Company Filing History:

goldMedal58 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2002-2019

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Areas of Expertise:
Semiconductor Package
Fabrication Method
Heat Dissipation
Multi-Chip Stack
Chip Scale Package
Thermally Enhanced
Wafer Level
Bump Structure
Stacked Structure
Cooling Fluid
Heat Sink
Encapsulant
58 patents (USPTO):Explore Patents
1. 10242972 - Package structure and fabrication method thereof (2019-03-26),
2. 8895366 - Fabrication method of semiconductor package (2014-11-25),
3. 8698326 - Semiconductor package and fabrication method thereof (2014-04-15),
4. 8420521 - Method for fabricating stack structure of semiconductor packages (2013-04-16),
5. 8361843 - Method for fabricating heat dissipation package structure (2013-01-29),
6. 8207620 - Flip-chip semiconductor package and chip carrier for preventing corner delamination (2012-06-26),
7. 8183092 - Method of fabricating stacked semiconductor structure (2012-05-22),
8. 8062933 - Method for fabricating heat dissipating package structure (2011-11-22),
9. 8058100 - Method for fabricating chip scale package structure with metal pads exposed from an encapsulant (2011-11-15),
10. 8013436 - Heat dissipation package structure and method for fabricating the same (2011-09-06),
11. 8008769 - Heat-dissipating semiconductor package structure and method for manufacturing the same (2011-08-30),
12. 7993967 - Semiconductor package fabrication method (2011-08-09),
13. 7981729 - Fabrication method of multi-chip stack structure (2011-07-19),
14. 7855443 - Stack structure of semiconductor packages and method for fabricating the stack structure (2010-12-21),
15. 7772685 - Stacked semiconductor structure and fabrication method thereof (2010-08-10),

Title: The Innovative Journey of Cheng-Hsu Hsiao

Introduction:

Cheng-Hsu Hsiao, a talented inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Cheng-Hsu Hsiao's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

Throughout his illustrious career, Cheng-Hsu Hsiao has been recognized for his pioneering work in developing sustainable solutions for environmental challenges. His inventions have not only revolutionized industries but have also positively impacted the world we live in.

Collaborations:

Cheng-Hsu Hsiao has collaborated with leading research institutions, universities, and innovative companies to further his inventions and bring them to market. His ability to work in multidisciplinary teams has led to the successful implementation of his groundbreaking ideas.

Conclusion:

In conclusion, Cheng-Hsu Hsiao's passion for innovation, coupled with his dedication to creating a sustainable future, has solidified his position as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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